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APA4863
Stereo 2.2W Audio Power Amplifier
Features
* * * *
Depop Circuitry Integrated Thermal Shutdown Circuitry Integrated Bridge-Tied Load (BTL) or Single-Ended (SE) Modes Operation Output Power at 1% THD+N, VDD=5V - 2.2W/Ch (typ) into a 3 Load - 1.8W/Ch (typ) into a 4 Load - 1.2 W/Ch (typ) into a 8 Load
General Description
The APA4863 is a stereo bridge-tied audio power amplifier in various power packages , including SOP , TSSOP and TSSOP-P . When connecting to a 5V voltage supply , the APA4863 is capable of delivering 2.2W/1.8W/1.2W of continuous RMS power per channel into 3/4/8 bridge-tied loads with less than 1% THD+N respectively . When APA4863 operates in the single-ended load , it is capable of delivering 90mW of continuous RMS power per channel into 32 load . The APA4863 simplifies design and frees up board space for other features . The APA4863 also served well in low-voltage applications , which provides 750mW (1% THD+N) per channel into 4 loads with a 3.3V supply voltage . Both of the depop circuitry and the thermal shutdown protection circuitry are integrated in the APA4863 , that reduces pops and clicks noise during power up and when using the shutdown mode and protects the chip from being destroyed by over-temperature failure . To simplify the audio system design in notebook computer applications , the APA4863 combines a stereo bridge-tied loads mode for speaker drive and a stereo single-end mode for headphone drive into a single chip , where both modes are easily switched by the HP-IN input control pin signal . For power sensitive applications , the APA4863 also features a shutdown function which keeps the supply current only 0.5 A (typ.) .
* * *
Shutdown Control Mode, ISD= 0.5 A Output Power (SE) at 0.5% THD+N, VDD=5V - 90mW/Ch (typ.) into a 32 Load Various Power Packages Available SOP, TSSOP, TSSOP-P
Applications
* * *
Stereo Audio Power Amplifier for Notebook Computer Portable Televisions Portable and Desktop Computers
Ordering Information
APA4863
Handling Code Temp. Range Package Code Package Code K: SOP O: TSSOP Temp. Range I : -40 to 85 C Handling Code TU : Tube TR : Tape & Reel
R: TSSOP-P*
TY: Tray
* TSSOP-P is a standard TSSOP package with a thermal pad exposed on the bottom of the package. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 1 www.anpec.com.tw
APA4863
Block Diagram
VDD CS 0.1F 4, 13 6 8 - IN A + IN A* CO 5
Audio Input
RF
C1 1 F
CB 2.2F Audio Input
VDD / 2 50K - IN B + IN B*
R1 C1 1 F VDD 20K RF 20K
Shutdown HP-IN 2,7,15
To Control Pin on Headphone Jack
16 100K
GND
* +INA and +INB pins are connected to Bypass pin inside the IC.
Absolute Maximum Ratings
(Over operating free-air temperature range unless otherwise noted.)
Symbol VDD TA TJ TSTG TS VESD Parameter Supply Voltage Operating Ambient Temperature Range Maximum Junction Temperature Storage Temperature Range Soldering Temperature,10 seconds Electrostatic Discharge Rating 6 -40 to 85 150 -65 to +150 260 -2000 to 2000
*1
Note: *1. Human body model : C=100pF, R=1500, 3 positive pulses plus 3 negative pulses
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
2
+
100
1
-
+
9
-
11
20K
+
-
10
Bypass
50 + OUT A 3
+
20K 20K 20K - OUT B 20K 20K + OUT B 14 12
20K
-
R1
20K
- OUT A
+
RL 8 100F 1K Control Pin Ring
To HP-IN Circuit Sleeve
Tip CO
Headphone Jack
+
100F RL 8 1K
Unit V C C C C V
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APA4863
Recommended Operating Conditions
Min. Supply Voltage, VDD Operating free-air VDD=5V, temperature, TA 250mW/Ch average power VDD=5V, 1.8 W/Ch average power Common mode VDD=5 V input voltage, VICM VDD=3.3V 4- stereo BTL drive, with proper PCB design 4- stereo BTL drive, with proper PCB design and 300 CFM forced-air cooling 3 -20 Typ. 5 Max. 5.5 85 Unit V C
-20
85
1.25 1.25
4.5 2.7 V
Dissipation Rating Table
Package SO16 + TSSOP ++ TSSOP-P ++ Air Flow (CFM) 0 0 200 0 200 Thermal Resistance JA(C/W) 50 73.2 66.6 37.6 32.3 T A 25C 2.5W 1.7W 1.8W 3.3W 3.8W T A=70C 1.6W 1.1W 1.2W 2.1W 2.4W
+ : The parameter is measured with the recommended copper heat sink pattern on an 2-layer PCB, 11.7 in2 3.0x2.4 in2 in PCB, 1oz. copper, 3.0x1.5 in2 in coverage at Top-layer and Bottom-layer at 100% coverage (7.2in2). ++:The parameter is measured with the JEDEC standard test boards (multi-layer PCB).
Electical Characteristics
Electrical Characteristics for Entire IC
The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25C
Symbol VDD IDD ISD VIH VIL
Parameter Supply Voltage Quiescent Power Supply Current Shutdown Current Headphone High Input Voltage Headphone Low Input Voltage
Test Conditions
APA4863 Min. 3 Typ. 9 5 0.5 Max. 5.5 13.5 7.5
Unit V mA A V
V IN=0V, IO=0A, HP-IN=0V V IN=0V, IO=0A, HP-IN=4V V PIN1= VDD
5 4
0.8
V
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Electical Characteristics Cont.
Electrical Characteristics for BTL Mode Operation
The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25C
Symbol V OS PO
Parameter Output Offset Voltage Output Power
Test Conditions V IN=0V THD=1%, f=1kHz R L=3 R L=4 R L=8
APA4863 Typ. 5 2.2 1.8 1.2
Unit mV W
THD+N
RSRR X TALK SNR
THD=10%, f=1kHz R L=3 R L=4 R L=8 Total Harmonic Distortion + Noise A VD =2, f=1kHz R L=4 , P O =1.8W R L=8 , P O =1W Power Supply Rejection Ratio V DD =5V, V RIPPLE=200Mv Rms , R L=8 C B=2.2F Channel Separation f=1kHz , C B =2.2F, P O =1W, R L=8 Signal-to-Noise Ratio V DD =5V, P O =1.1W, R L=8
2.7 2.3 1.5 0.3 0.15 64 90 95 % dB dB dB
Electrical Characteristics for SE Mode Operation
The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25C
Symbol V OS PO
Parameter Output Offset Voltage Output Power
Test Conditions
V IN=0V THD=0.5%, f=1kHz, RL=32 THD=1%, f=1kHz, RL=8 THD=10%, f=1kHz, RL=8 THD+N Total Harmonic Distortion A V= -1 , P O=75mW, f=1kHz, RL=32 plus Noise RSRR Power Supply Rejection V RIPPLE=200mV RMS , f=1kHz, CB=2.2F, RL=8 Ratio X TALK Channel Separation f=1kHz , CB=2.2F, P O=32mW, RL=32 SNR Signal-to-Noise Ratio V DD=5V , PO =340mW, RL=8
APA4863 Typ. 5 90 320 400 0.02 49 85 95
Unit mV mW % dB dB dB
Truth Table for Logic Inputs
Shutdown Low Low High High HP-IN Low High Low High APA4863 Mode Bridge -Tied Single-Ended APA4863 Shutdown APA4863 Shutdown
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Pin Description
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B
SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A NC NC 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B NC NC
SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A
Top View for SOP
Top View for TSSOP
SHUTDOWN GND + OUT A VDD - OUT A - IN A GND + IN A GND GND
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B GND GND
Thermal Pad
Top View for TSSOP-P
Bottom View for TSSOP -P
Pin Description
Name GND V DD + INA - INA + OUT A - OUT A + IN B - IN B + OUT B - OUT B BYPASS HP-IN SHUTDOWN I/O I I I O O I I O O I I Description Ground connection of circuitry Supply voltage input Non-inverting input of channel A, connected to bypass pin inside the IC Input pin of channel A A channel + output in BTL mode, high impedance in SE mode A channel - output in BTL mode, + output in SE mode Non-inverting input of channel B, connected to bypass pin inside the IC Input pin of channel B B channel + output in BTL mode, high impedance in SE mode B channel - output in BTL mode, + output in SE mode Connect to voltage divider for internal mid-supply bias Headphone control pin input, hold high for single-ended mode operation Shutdown mode control pin input, places entire IC in shutdown mode when held high, IDD= 0.5A
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Typical Characteristics
10
THD+N vs Output Power THD+N vs Frequency
10 VDD=5V, PO=1.8W RL=4, BW<80kHz 1
VDD=5V, RL=4 BW<80kHz 20Hz
1
THD+N (%)
20kHz 1kHz 0.1
THD+N (%)
0.1
0.01
0.01 10m
20
100
1k
10k 20k
100m
1
3
Figure 2 : Frequency (Hz)
Figure 1 : Output Power (W)
Power Dissipation vs Output Power
1.4 1.2
10
THD+N vs Frequency
VDD=5V, PO=1W RL=8, BTL Mode 1
Power Dissipation (W)
VDD=5V
1 0.8 0.6 0.4 0.2
0.01
THD+N (%)
RL=4 RL= 8
AVD=10 0.1 AVD=2
0
0
0.5
1
1.5
2
2.5
20
100
1k
10k 20k
Figure 3 : Output Power (W)
Figure 4 : Frequency (Hz)
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Typical Characteristics Cont.
THD+N vs Frequency
10 VDD=5V, PO=150mW RL=16, SE Mode 1
10
THD+N vs Frequency
VDD=5V, PO=75mW RL=32, SE Mode
1
THD+N (%)
THD+N (%)
0.1
AV= -5 AV= -1
0.1 AV= -5
AV= -1
0.001
0.001
20 100 1k 10k 20k
20
100
1k
10k 20k
Figure 5 : Frequency (Hz)
Figure 6 : Frequency (Hz)
THD+N vs Output Power
10
THD+N vs Output Power
10
1
f= 20Hz
1
THD+N (%)
THD+N (%)
f= 20kHz 0.1 f= 20Hz f= 1kHz VDD=5V, RL=16 AV=-1, BW< 80kHz SE Mode 70m 200m 500m
f= 20kHz 0.1 f= 1kHz VDD=5V, RL=8 AVD=2, BW< 80kHz BTL Mode 0.01 10m 100m 1 2
0.001 10m
Figure 7 : Output Power (W)
Figure 8 : Output Power (W)
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Typical Characteristics Cont.
THD+N vs Output Power
10 VDD=5V, RL=32 AV=-1, BW< 80kHz SE Mode
10
THD+N vs Output Power
1
f= 20kHz 1
THD+N (%)
f= 20Hz
THD+N (%)
f= 20kHz 0.1 f= 20Hz
f= 1kHz 0.1 VDD=3.3V, RL=4 AVD= 2
f= 1kHz 0.001 10m
50m
100m
200m
0.01
10m
100m
1
2
Figure 9 : Output Power (W)
Figure 10 : Output Power (W)
THD+N vs Frequency
10 VDD=3.3V, PO=700mW RL=4, AVD=2
10
THD+N vs Output Power
f= 20kHz
1
1
THD+N (%)
THD+N (%)
f= 20Hz 0.1 f= 1kHz VDD=3.3V, RL=8, AVD=2
0.1
0.01
0.01
20
100
1k
10k 20k
10m
100m
1
Figure 11 : Frequency (Hz)
Figure 12 : Output Power (W)
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Typical Characteristics Cont.
10
THD+N vs Frequency
VDD=3.3V, PO=450mW RL=8, AVD=2
Output Power vs Load Resistance
0.2 VDD=3.3V, f=1kHz AVD=2, BW<80kHz 0.15
1
Output Power (W)
THD+N (%)
THD+N = 10% 0.1
0.1
0.05
THD+N = 1%
0.01 20
0
100
1k
10k 20k
0
10
20
30
40
Figure 13 : Frequency (Hz)
Figure 14 : Load Resistance ()
Power Dissipation vs Output Power
0.35 VDD=3.3V, SE Mode 0.3
Output Power vs Supply Voltage
2 1.75 1.5 VDD=5V, f=1kHz RL=8, BW<80kHz BTL Mode THD+N = 10%
Power Dissipation (W)
Output Power (W)
0.25 0.2 0.15 0.1 0.05 0 0
RL=8
1.25 1 0.75 0.5 0.25
RL=16
THD+N = 1%
0.2
0.4
0.6
0.8
0
2 2.5
3
3.5
4
4.5
5
5.5
Figure 15 : Output Power (W)
Figure 16 : Supply Voltage (V)
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Typical Characteristics Cont.
Output Power vs Supply Voltage
300 250 VDD=5V, f=1kHz RL=16, BW<80kHz SE Mode
Output Power vs Supply Voltage
150 130 110 VDD=5V, f=1kHz RL=32, BW<80kHz SE Mode THD+N = 10%
Output Power
200 THD+N = 10% 150 100 THD+N = 1% 50 0
Output Power
90 70 50
THD+N = 1% 30 10
2
2.5
3
3.5
4
4.5
5
5.5
-10
2
2.5
3
3.5
4
4.5
5
5.5
Supply Voltage (V) Figure 17
Supply Voltage (V) Figure 18
Output Power vs Load Resistance
1.75 1.5 VDD=5V, f=1kHz AVD=2, BW<80kHz BTL Mode
Output Power vs Load Resistance
1 0.8 VDD=5V, f=1kHz AV=-1, BW<80kHz SE Mode
Output Power (W)
1 10% THD+N 0.75 0.5 0.25 0 8 18 28 38 48 58 68 1% THD+N
Output Power (W)
1.25
0.6
0.4 10% THD+N 0.2 1% THD+N 0 0 10 20 30 40 50 60 70
Figure 19 : Load Resistance ()
Figure 20 : Load Resistance ()
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Typical Characteristics Cont.
Power Dissipation vs Output Power
1.4 1.2 RL=4
Power Dissipation vs Output Power
0.18 0.16 RL=8 RL=16
Power Dissipation
1 0.8 0.6 0.4 0.2 0 0 0.5 RL=16 RL=32 RL=8
Power Dissipation
VDD=5V, f=1kHz THD+N <1% BW<80kHz BTL Mode
0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 0
RL=32
VDD=5V, f=1kHz THD+N <1% BW<80kHz SE Mode 0.3 0.4 0.5
1
1.5
0.1
0.2
Output Power (W) Figure 21
Output Power (W) Figure 22
Noise Floor
100
+0
Channel Separation
Output Noise Voltage (V)
VO+ + VOVO10
Channel Separation (dB)
-20 -40 -60 -80 -100 -120 20
VDD=5V, RL=8 AVD=2, PO=1W CB=1F BTL Mode
Channel A to B
VDD=5V, RL=8 AVD=2, CB=1F 1 20 100 1k 10k 20k
Channel B to A 100 1k 10k 20k
Figure 23 : Frequency (Hz)
Figure 24 : Frequency (Hz)
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Typical Characteristics Cont.
Channel Separation
+0 VDD=5V, RL=32 AV=-1, PO=75mW CB=1F SE Mode
Open Loop Frequency Response
+80 +70 +60 VDD=5V SE Mode Gain
Channel Separation (dB)
-20 -40 -60
Gain (dB)
+50 +40 +30 +20
Channel A to B -80 -100 Channel B to A -120 20 100 1k 10k 20k
+10 +0 100
Phase 1k 10k 100k 1M 10M
Figure 25 : Frequency (Hz)
Figure 26 : Frequency (Hz)
Supply Current vs Supply Voltage
10 VIN=0V No Load 8
Supply Current (mA)
6
BTL Mode (HP-IN=GND)
4 SE Mode (HP-IN=VDD)
2
0
2
2.5
3
3.5
4
4.5
5
5.5
Figure 27 : Supply Voltage(V)
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Packaging Information
TSSOP/ TSSOP-P ( Reference JEDEC Registration MO-153)
e N
2x E/2
E1
E
1
23
e/2 D A2 A ( 2) GAUGE PLANE S R1
b D1
A1
EXPOSED THERMAL PAD ZONE E2 0.25 L (L1) ( 3)
R
1
BOTTOM VIEW (THERMALLY ENHANCED VARIATIONDS ONLY)
Dim Min. A A1 A2 D D1 e E E1 E2 L L1 R R1 S 1 2 3
Millimeters 0.00 0.80 6.4 (N=20PIN) 7.7 (N=24PIN) 2.20 (N=20PIN) 2.70 (N=24PIN) Thermally Enhanced 0.65 BSC 6.40 BSC 4.30 4.50 1.50 0.45 0.75 1.0 REF 0.09 0.09 0.2 0 8 12 REF 12 REF
13
Inches Min. 0.000 0.031 0.252 (N=20PIN) 0.303 (N=24PIN) 0.087 (N=20PIN) 0.106 (N=24PIN) Thermally Enhanced 0.026 BSC 0.252 BSC 0.169 0.177 0.059 0.018 0.030 0.039REF 0.004 0.004 0.008 0 8 12 REF 12 REF
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Max. 1.2 0.15 1.05 6.6 (N=20PIN) 7.9 (N=24PIN)
Max. 0.047 0.006 0.041 0.260 (N=20PIN) 0.311 (N=24PIN)
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
APA4863
Packaging Information
SO - 300mil ( Reference JEDEC Registration MS-013)
D N
H
E
GAUGE PLANE
1
23
A e B A1
L
1
Dim A A1 B D E e H L N 1
Millimeters Min. Max. 2.35 0.10 0.33 7.40 10 0.40 0 2.65 0.30 0.51 7.60 10.65 1.27 8
Variations- D Variations Min. Max. Dim SO-16 SO-18 SO-20 SO-24 SO-28 SO-14 10.10 11.35 12.60 15.20 17.70 8.80 10.50 11.76 13 15.60 18.11 9.20 A A1 B D E e H L N 1
Inches Min. Max. 0.093 0.1043 0.004 0.0120 0.013 0.020 See variations 0.2914 0.2992 0.050BSC 0.394 0.016 0 0.419 0.050 8
Variations- D Variations Min. Max. SO-16 SO-18 SO-20 SO-24 SO-28 SO-14 0.398 0.413 0.447 0.463 0.496 0.512 0.599 0.614 0.697 0.713 0.347 0.362
See variations 1.27BSC
See variations
See variations
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Physical Specifications
Terminal Material Lead Solderability Packaging Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. 2000 devices per reel
Reflow Condition
temperature
(IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
Peak temperature
183C Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183C to Peak) 3C/second max. 120 seconds max Preheat temperature 125 25C) 60 - 150 seconds Temperature maintained above 183C Time within 5C of actual peak temperature 10 -20 seconds Peak temperature range 220 +5/-0C or 235 +5/-0C Ramp-down rate 6 C /second max. 6 minutes max. Time 25C to peak temperature VPR 10 C /second max.
60 seconds 215-219C or 235 +5/-0C 10 C /second max.
Package Reflow Conditions
pkg. thickness 2.5mm and all bgas Convection 220 +5/-0 C VPR 215-219 C IR/Convection 220 +5/-0 C pkg. thickness < 2.5mm and pkg. volume 350 mm pkg. thickness < 2.5mm and pkg. volume < 350mm Convection 235 +5/-0 C VPR 235 +5/-0 C IR/Convection 235 +5/-0 C
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001
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APA4863
Reliability test program
Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245C , 5 SEC 1000 Hrs Bias @ 125 C 168 Hrs, 100 % RH , 121C -65C ~ 150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 100mA
Carrier Tape & Reel Dimensions
t P P1 D Po E
F W
Bo
Ao
Ko D1
T2
J C A B
T1
Application SOP-16W Application SOP-16W
A 3303 F 7.5 0.1
B 100 2
C 13 + 0.5
J 2 0.5
T1 T2 16.4 +0.3 2.5 0.5 -0.2
W 16 0.2
P 12 0.1
E 1.75 0.1
D D1 Po P1 Ao Bo Ko t 1.5 +0.1 1.5 +0.25 4.0 0.1 2.0 0.1 10.9 0.1 10.8 0.1 3.0 0.1 0.30.013
(mm)
Cover Tape Dimensions
Carrier Width Cover Tape Width 16 13.3 (mm)
Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 16 www.anpec.com.tw
APA4863
Customer Service
Analog and Power Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 24F-1. No. 268, Sec. 2, PeiHsin Rd. HsinDian, Taipei County, Taiwan, R. O. C. Tel : 886-2-86658533 Fax : 886-2-86658529
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